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 Preliminary data
BUZ 100S-4
SIPMOS (R) Power Transistor
* Quad-channel * Enhancement mode * Avalanche-rated * dv/dt rated
Type BUZ 100S-4
VDS
55 V
ID
8A
RDS(on)
0.02
Package P-DSO-28
Ordering Code C67078-S. . . . -A..
Maximum Ratings Parameter Continuous drain current one channel active Symbol Values 8 Unit A
ID IDpuls
32
TA = 25 C
Pulsed drain current one channel active
TA = 25 C
Avalanche energy, single pulse
EAS
380 dv/dt 6
mJ
ID = 8 A, VDD = 25 V, RGS = 25 L = 11.8 mH, Tj = 25 C
Reverse diode dv/dt kV/s
IS = 8 A, VDS = 40 V, diF/dt = 200 A/s Tjmax = 175 C
Gate source voltage Power dissipation ,one channel active
VGS Ptot
20 2.4
V W
TA = 25 C
Operating temperature Storage temperature IEC climatic category, DIN IEC 68-1
Tj Tstg
-55 ... + 175 -55 ... + 175 55 / 175 / 56
C
Semiconductor Group
1
01/Oct/1997
Preliminary data
BUZ 100S-4
Thermal Characteristics Parameter Symbol min. Thermal resistance, junction - soldering point 1) Thermal resistance, junction - ambient 2) Values typ. max. tbd 62.5 K/W Unit
RthJS RthJA
-
1) Device on 50mm*50mm*1.5mm epoxy PCB FR4 with 6 cm2 (one layer,70m thick) copper area for Drain connection. PCB is vertical without blown air.
2) one channel active
Electrical Characteristics, at Tj = 25C, unless otherwise specified Parameter Symbol min. Static Characteristics Drain- source breakdown voltage Values typ. max. Unit
V(BR)DSS
55 3 0.1 10 0.016 4
V
VGS = 0 V, ID = 0.25 mA, Tj = 25 C
Gate threshold voltage
VGS(th)
2.1
VGS=VDS, ID = 130 A
Zero gate voltage drain current
IDSS
0.1 1 100
A
VDS = 55 V, VGS = 0 V, Tj = -40 C VDS = 55 V, VGS = 0 V, Tj = 25 C VDS = 55 V, VGS = 0 V, Tj = 150 C
Gate-source leakage current
IGSS
100
nA 0.02
VGS = 20 V, VDS = 0 V
Drain-Source on-resistance
RDS(on)
VGS = 10 V, ID = 8 A
Semiconductor Group
2
01/Oct/1997
Preliminary data
BUZ 100S-4
Electrical Characteristics, at Tj = 25C, unless otherwise specified Parameter Symbol min. Dynamic Characteristics Transconductance Values typ. max. Unit
gfs
15 1900 615 310 -
S pF 2375 770 390 ns 25 40
VDS 2 * ID * RDS(on)max, ID = 8 A
Input capacitance
Ciss Coss
-
VGS = 0 V, VDS = 25 V, f = 1 MHz
Output capacitance
VGS = 0 V, VDS = 25 V, f = 1 MHz
Reverse transfer capacitance
Crss
-
VGS = 0 V, VDS = 25 V, f = 1 MHz
Turn-on delay time
td(on)
VDD = 30 V, VGS = 10 V, ID = 8 A RG = 4.6
Rise time
tr
25 40
VDD = 30 V, VGS = 10 V, ID = 8 A RG = 4.6
Turn-off delay time
td(off)
75 115
VDD = 30 V, VGS = 10 V, ID = 8 A RG = 4.6
Fall time
tf
35 3.8 50 63 4.43 55 nC 5.7 75 95 V -
VDD = 30 V, VGS = 10 V, ID = 8 A RG = 4.6
Gate charge at threshold
Qg(th) Qg(7)
-
VDD = 40 V, ID 0.1 A, VGS =0 to 1 V
Gate charge at 7.0 V
VDD = 40 V, ID = 8 A, VGS =0 to 7 V
Gate charge total
Qg(total)
-
VDD = 40 V, ID = 8 A, VGS =0 to 10 V
Gate plateau voltage
V(plateau)
VDD = 40 V, ID = 8 A
Semiconductor Group
3
01/Oct/1997
Preliminary data
BUZ 100S-4
Electrical Characteristics, at Tj = 25C, unless otherwise specified Parameter Symbol min. Reverse Diode Inverse diode continuous forward current IS TA = 25 C Inverse diode direct current, pulsed A 0.95 70 0.2 8 32 V 1.6 ns 105 C 0.3 Values typ. max. Unit
ISM VSD trr Qrr
TA = 25 C
Inverse diode forward voltage
VGS = 0 V, IF = 16 A
Reverse recovery time
VR = 30 V, IF=lS, diF/dt = 100 A/s
Reverse recovery charge
VR = 30 V, IF=lS, diF/dt = 100 A/s
Semiconductor Group
4
01/Oct/1997
Preliminary data
BUZ 100S-4
Power dissipation Ptot = (T)
Drain current ID = (TC) parameter: VGS 10 V
9 A
2.6 W 2.2
RthJC thJA
Ptot
2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4
ID
7 6 5 4 3 2 1
0.2 0.0 0 20 40 60 80 100 120 140 C T 180 0 0 20 40 60 80 100 120 140 C 180
TC
Semiconductor Group
5
01/Oct/1997
Preliminary data
BUZ 100S-4
Typ. output characteristics ID = (VDS) parameter: tp = 80 s
l
Typ. drain-source on-resistance RDS (on) = (ID) parameter: tp = 80 s, Tj = 25 C
0.065
18 A
k tot = 2W ji P h ge fd
VGS [V] 4.0 ca b 4.5
c 5.0 5.5 6.0 6.5 7.0 7.5 8.0 9.0 10.0 20.0
0.055
a
ID
14 12 10 8
RDS (on) 0.050
0.045 0.040 0.035 0.030
c b
d e f g h i
0.025 0.020 0.015 0.010
VGS [V] =
a 4.5 4.0 5.0 b 5.5 c 6.0 d 6.5 e f 7.0 7.5 g 8.0 h i j 9.0 10.0 20.0
b
d e f h i j g
6 4 2
j k l
a
0.005 V 5.0 0.000 0
0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0
2
4
6
8
10
12
A
16
VDS
ID
Typ. transfer characteristics ID = f (VGS)
parameter: tp = 80 s VDS2 x ID x RDS(on)max
120 A 100
ID
90 80 70 60 50 40 30 20 10 0 0 1 2 3 4 5 6 7 8 V VGS 10
Semiconductor Group
6
01/Oct/1997
Preliminary data
BUZ 100S-4
Drain-source on-resistance RDS (on) = (Tj) parameter: ID = 8 A, VGS = 10 V
0.055
Gate threshold voltage VGS (th) = (Tj) parameter: VGS = VDS, ID = 130 A
4.6 V 4.0
0.045 RDS (on) 0.040
98%
VGS(th)
3.6 3.2
typ
0.035 2.8 0.030
98%
0.025
2.4 2.0 1.6 1.2 0.8 0.4
2%
typ
0.020 0.015 0.010 0.005 0.000 -60 -20 20 60 100 C 180
0.0 -60
-20
20
60
100
C
180
Tj
Tj
Typ. capacitances
C = f (VDS) parameter:VGS = 0V, f = 1MHz
10 4
Forward characteristics of reverse diode IF = (VSD) parameter: Tj, tp = 80 s
10 3
A
C
pF
IF
10 2
Ciss
10 3
Coss
10 1
Tj = 25 C typ Crss Tj = 175 C typ Tj = 25 C (98%) Tj = 175 C (98%)
10 2 0 10 0 0.0
5
10
15
20
25
30
V 40 VDS
0.4
0.8
1.2
1.6
2.0
2.4
V
3.0
VSD
Semiconductor Group
7
01/Oct/1997
Preliminary data
BUZ 100S-4
Avalanche energy EAS = (Tj) parameter: ID = 8 A, VDD = 25 V RGS = 25 , L = 11.8 mH
400 mJ
Typ. gate charge VGS = (QGate) parameter: ID puls = 8 A
16
V
EAS 320
280 240 200 160 120
VGS
12
10
8
0,2 VDS max
0,8 VDS max
6
4 80 40 0 20 2 0 0
40
60
80
100
120
140
C
180
10
20
30
40
50
60
70
nC
90
Tj
QGate
Drain-source breakdown voltage V(BR)DSS = (Tj)
65
V
V(BR)DSS
61
59
57
55
53
51 49 -60
-20
20
60
100
C
180
Tj
Semiconductor Group
8
01/Oct/1997


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